SanDisk Corporation, the global leader in flash memory cards, today announced its next generation of iNAND and iNAND Ultra embedded flash drives featuring smaller and thinner form factors. Available in packages as small as 11.5mm x 13mm x 1mm, SanDisk's new iNAND and iNAND Ultra e.MMC products support the increasing demand for slimmer and more compact smartphone and tablet designs.
SanDisk reduced its iNAND package sizes by using advanced 24nm generation NAND memory chips, which are more compact than previous versions, and reduced its iNAND package heights by using advanced packaging technologies. iNAND EFDs are based on SanDisk's three-bit-per-cell NAND
SanDisk iNAND EFDs come in a variety of storage capacities ranging from 2GB to 64GB for quick integration into handset and other designs that require an e.MMC interface. With managed physical partitions, customizable attributes and advanced power failure immunity, SanDisk iNAND EFDs feature highly reliable boot code and application storage device capabilities in addition to being a mass storage solution. iNAND drives use advanced caching technology that improves system responsiveness, and are designed based on SanDisk's usage analysis capabilities. iNAND EFDs are based on both MLC and X3 technologies.
